QFN/DFN packaging compares the traditional SOP/TSOP packaging. Due to the shorter conductivity between internal pins and pads, it can provide better electrical properties. In addition, the exposed lead frame pad can be directly welded on the circuit board, which is more conducive to the packaging body heat dissipation. Coupled with its small size and light weight, this series of products can be widely used in the market.

Equipped with logic, touch, power management, MCU and other chips, widely used in RF, the Internet of Things, smart home, mobile terminal, car and other fields.

Product size covers2x2 ~ 10x10mm；

Number of pins 8L ~ 88L;

Product thickness 0.6mm/0.8mm；

You can provide the multi -size line diameter of the golden line/silver alloy line/plating copper wire;

Advanced wet wet wing QFN/DFN (Wettable FLANK QFN/DFN) technology.

In addition to the conventional QFN/DFN series products, ZKT provides Wettable FLANK QFN/DFN packaging services, which provides more reliable solder joints with PCB. For the past, it is difficult to confirm welding status from the appearance. This product can achieve welding welding. Point AOI automatic detection.